| - Surface resistivity: 10^10 - 10^12 ohms/sq.
| - Thermal performance to 225°F (107°C)
| - Applications: Wafer Combs, Hard Disk Drive Fixtures
|
| - Surface resistivity: 10^6 - 10^9 ohms/sq.
| - Flexural Modulus of 350,000 psi
with an HDT of 225 @ 264 psi - Extremely low moisture
absorption of 0.25% @ 24 hours and 0.75% @ saturation
| - Applications: Integrated Chip Test Jigs, Basic Electronics Assembly Fixturing, Basic Test Sockets & PCB Test Jigs
|
| - Surface resistivity: 10^6 - 10^9 ohms/sq.
| - Thermal performance to 240°F (107°C)
| - Applications: Disk Drive Fixtures, Semi/Electronic Components, Telecom & Automotive Fixtures
|
| - Surface resistivity: 10^4 - 10^6 ohms/sq.
| - Thermal performance to 410°F (210°C)
| - Applications: Handling Trays
|
| - Surface resistivity: 10^6 - 10^9 ohms/sq.
| - Thermal performance to 420°F (215°C)
| - Applications: Test Sockets for IC Chips, Probe Card Components
|
| - Surface resistivity: 10^6 - 10^9 ohms/sq.
| - Thermal performance to 420°F (215°C)
| - Applications : Test Sockets for IC Chips, Probe Card Components
|
| - Surface resistivity: 10^6 - 10^9 ohms/sq.
| - Delivers a flexural modulus of 760,000 psi
along with a melting point of 644°F - Extremely low moisture absorption of 0.05%
@ 24 hours and 0.35% @ saturation
| - Applications: Integrated Chip Trays & Carriers, PCB Board Manufacturing & Handling, Fixturing for Electronic Assemblies
|
| - Surface resistivity: 10^6 - 10^9 ohms/sq.
| - Very dimensionally stable
- Exceptional chemical resistance
- Not subject to dielectric breakdown
| - Applications: Critical Test Fixtures, Wafer Handling, Test Sockets for IC Chips
|
| - Surface resistivity: 10^10 - 10^12 ohms/sq
| | - Applications: Critical Test Fixtures, Wafer Handling, Test Sockets for IC Chips, Inserts
|
| - Surface resistivity: 10^10 - 10^12 ohms/sq
| - Very low coefficient of friction
- Broad chemical resistance
- Thermal performance to 500°F (260°C)
| - Applications: Inserts, Sockets for Test Equipment
|
| - Surface resistivity: 10^10 - 10^12 ohms/sq
| - Combination of electrostatic dissipation (ESd), high strength and heat resistance
- Resist dielectric breakdown at high voltages (>100V)
| - Applications: Nests, Sockets and Contractors for Test Equipment and Other Device Handling Components, IC Device Testing Fixtures
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