|  | Surface resistivity: 10^10 - 10^12 ohms/sq.
 | Thermal performance to 225°F (107°C)
 | Applications: Wafer Combs, Hard Disk Drive Fixtures
 | 
|  | Surface resistivity: 10^6 - 10^9 ohms/sq.
 | Flexural Modulus of 350,000 psiwith an HDT of 225 @ 264 psi
Extremely low moistureabsorption of 0.25% @ 24 hours
 and 0.75% @ saturation
 | Applications: Integrated Chip Test Jigs, Basic Electronics Assembly Fixturing, Basic Test Sockets & PCB Test Jigs
 | 
|  | Surface resistivity: 10^6 - 10^9 ohms/sq.
 | Thermal performance to 240°F (107°C)
 | Applications: Disk Drive Fixtures, Semi/Electronic Components, Telecom & Automotive Fixtures
 | 
|  | Surface resistivity: 10^4 - 10^6 ohms/sq.
 | Thermal performance to 410°F (210°C)
 | Applications: Handling Trays
 | 
|  | Surface resistivity: 10^6 - 10^9 ohms/sq.
 | Thermal performance to 420°F (215°C)
 | Applications: Test Sockets for IC Chips, Probe Card Components
 | 
|  | Surface resistivity: 10^6 - 10^9 ohms/sq.
 | Thermal performance to 420°F (215°C)
 | Applications : Test Sockets for IC Chips, Probe Card Components
 | 
|  | Surface resistivity: 10^6 - 10^9 ohms/sq.
 | Delivers a flexural modulus of 760,000 psialong with a melting point of 644°F
Extremely low moisture absorption of 0.05%@ 24 hours and 0.35% @ saturation
 | Applications: Integrated Chip Trays & Carriers, PCB Board Manufacturing & Handling, Fixturing for Electronic Assemblies
 
 | 
|  | Surface resistivity: 10^6 - 10^9 ohms/sq.
 | Very dimensionally stableExceptional chemical resistanceNot subject to dielectric breakdown
 | Applications: Critical Test Fixtures, Wafer Handling, Test Sockets for IC Chips
 | 
|  | Surface resistivity: 10^10 - 10^12 ohms/sq
 |  | Applications: Critical Test Fixtures, Wafer Handling, Test Sockets for IC Chips, Inserts
 | 
|  | Surface resistivity: 10^10 - 10^12 ohms/sq
 | Very low coefficient of frictionBroad chemical resistanceThermal performance to 500°F (260°C)
 | Applications: Inserts, Sockets for Test Equipment
 | 
|  | Surface resistivity: 10^10 - 10^12 ohms/sq
 | Combination of electrostatic dissipation (ESd), high strength and heat resistanceResist dielectric breakdown at high voltages (>100V)
 | Applications: Nests, Sockets and Contractors for Test Equipment and Other Device Handling Components, IC Device Testing Fixtures
 | 
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