Durostone® Key Properties
Durostone ® materials have excellent mechanical properties at elevated temperatures and are dimensionally stable and retain their flatness through repeated cycling in the PCB assembly process. The low thermal conductivity of Durostone ® ensures optimal thermal distribution across the work area. The base resin used to produce Durostone ® provides resistance to the chemicals used in fluxes and also prevents solder pick-up.
Common Durostone® Applications
Durostone ® materials are designed and typically recommended for use in manufacturing solder pallets for wave-solder applications of printed circuit boards (PCB's). These materials can also be used for carriers in solder paste printing, SMT placement, IR-reflow, and conformal coating operations.
Download our Durostone Machining and Fabrication Guidelines for recommended cutters, machining parameters, and additional information on fabricating and machining Durostone ® composites.
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